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Organic silicon thermal conductive gel

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JDB920N Organic silicon thermal conductive gel

JDB920N is an additive two component silicone thermal sealing material with good flowability and self-healing properties. After curing, a soft thermal conductive silicon gel is formed. Its excellent electrical properties make it very suitable for sealing various electronic components with high purity requirements. It has the characteristics of providing cushioning, shock absorption, heat dissipation and other functions for electronic components.

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Feature

● Two component 1:1 (volume ratio) mixing ratio, appropriate room temperature operation time.

● It can be cured at room temperature or quickly by heating, without releasing small molecules during curing.

● Low modulus, low internal stress, and strong resistance to cold and hot impacts.

● Excellent adhesion, self-healing, and excellent high-temperature stability at 200 ℃.

Parameter

項目		典型值		測試標準
混合前物性(23±2℃/50±5%RH )
組分	--	A	B		--
外觀	--	藍色半流淌	白色半流淌		--
粘度	Pa•s	250±50	250±50		GB/T 15223-2008
比重	g/cm³	2.0±0.10	2.0±0.10		GB/T 13477.2-2002
混合后物性(23±2℃/50±5%RH )
重量比混合	--	A:B=1:1			GB/T 13477.2-2002
外觀	--	藍色			---
粘度	Pa•s	250±50			GB/T 15223-2008
可操作時間（25℃）	min	60~70			--
完全固化時間（25℃）	h	4~8
完全固化時間(100℃)	min	10~25			GB/T 13477.5-2002
固化后性能( 23±2℃/50±5%RH×24hours )
硬度	Shore oo	50±5			GB/T 531.1—2008
導熱系數	W/m•K	2.0±0.2			GB/T 10297-1998
介電強度	kV/mm	≤15			GB/T 1408.1—2006
介電常數(60HZ)	--	≤4.0			GB/T 1409—2006
體積電阻率	Ω·cm

application

Used for heat dissipation and packaging protection of motors and high-power electronic components, especially for components with high thermal conductivity requirements.

Usage method

Instructions for use

● Clean the surface of the object being glued and keep the clean and dry surface.

● The product quickly cures at room temperature and fully cures within 24 hours.

matters needing attention

● Before use, please refer to the MSDS in detail.

● Rubber materials should be stored in a sealed manner, and the mixed rubber materials should be used up at once to avoid waste.

● This product is not a hazardous material, but avoid contact with skin and eyes.

● After long-term storage, the filler in the adhesive will settle. Please mix well before use, without affecting performance.

● Contact with a certain amount of the following chemicals can cause the adhesive to not cure:

1. Organic compounds containing N, P, and S.

2. Ionic compounds containing elements such as Sn, Pb, Hg, and As.

3. Compounds containing alkynes and polyvinyls.

● In order to avoid the above phenomenon, before using glue sealing, the residual rosin on the device should be wiped clean as much as possible, and solder with low lead content should be used as much as possible.

Packaging specifications

● 50cc, 200cc, 400cc, 5 gallons, 55 gallons.

Storage and transportation

● Store away from children, keep the product away from light and heat, and store it in a sealed container.

● When stored unopened at or below 28 ° C, the product has a shelf life of 6 months from the date of production.

● This product is non hazardous and is stored and transported as a general chemical.

What help can we provide for you?

Please inform us of your performance, design, and manufacturing issues. We will utilize our expertise in silicon-based materials, coating knowledge, and processing experience to provide you with services.

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Usage method